sfh 4258s sfh 4259s ir-lumineszenzdiode (850 nm) mit hoher ausgangsleistung high power infrared emitter (850 nm) lead (pb) free produc t - rohs compliant 2011-10-20 1 wesentliche merkmale ? infrarot led mit hoher ausgangsleistung ? halbwinkel sfh 4258s: 15 ? halbwinkel sfh 4259s: 25 ? hohe bestromung bei hohen temperaturen m?glich ? kurze schaltzeiten anwendungen ? industrie anwendungen ? infrarotbeleuchtung fr kameras ? ir-datenbertragung ? sensorik sicherheitshinweise je nach betriebsart emi ttieren diese bauteile hochkonzentrierte, nicht sichtbare infrarot- strahlung, die gef?hrlich fr das menschliche auge sein kann. produkte, die diese bauteile enthalten, mssen gem?? den sicherheits- richtlinien der iec-normen 60825-1 und 62471 behandelt werden. typ type bestellnummer ordering code strahlst?rkegruppierung 1) ( i f = 70 ma, t p = 20 ms) radiant intensity grouping 1) i e (mw/sr) sfh 4258s Q65111A1158 40 (typ. 100) sfh 4259s q65111a1159 25 (typ. 60) 1) gemessen bei einem raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr features ? high power infrared led ? half angle sfh 4258s: 15 ? half angle sfh 4259s: 25 ? high forward current allowed at high temperature ? short switching times applications ? industrial applications ? infrared illumination for cameras ? ir data transmission ? optical sensors safety advices depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. products which incorporate these devices have to follow the safety precautions given in iec 60825-1 and iec 62471.
2011-10-20 2 sfh 4258s, sfh 4259s grenzwerte ( t a = 25 c) maximum ratings bezeichnung parameter symbol symbol wert value einheit unit betriebs- und lagertemperatur operating and storage temperature range t op , t stg ? 40 + 85 c sperrspannung reverse voltage v r 5 v vorw?rtsgleichstrom forward current i f 70 ma sto?strom, t p = 300 s, d = 0 surge current i fsm 700 ma verlustleistung power dissipation p tot 245 mw w?rmewiderstand sperrschicht - umgebung bei montage auf fr4 platine, padgr??e je 16 mm 2 thermal resistance junction - ambient mounted on pc-board (fr4), padsize 16 mm 2 each w?rmewiderstand sperrschicht - l?tstelle bei montage auf metall-block thermal resistance junc tion - soldering point, mounted on metal block r thja r thjs 300 140 k/w k/w kennwerte ( t a = 25 c) characteristics bezeichnung parameter symbol symbol wert value einheit unit wellenl?nge der strahlung wavelength at peak emission i f = 70 ma peak 860 nm centroid-wellenl?nge der strahlung centroid wavelength i f = 70 ma centroid 850 nm spektrale bandbreite bei 50% von i max spectral bandwidth at 50% of i max i f = 70 ma ? 30 nm abstrahlwinkel half angle sfh 4258s sfh 4259s ? ? 15 25 grad deg.
sfh 4258s, sfh 4259s 2011-10-20 3 aktive chipfl?che active chip area a 0.09 mm 2 abmessungen der aktiven chipfl?che dimension of the active chip area l b l w 0.3 0.3 mm2 schaltzeiten, i e von 10% auf 90% und von 90% auf 10%, bei i f = 70 ma, r l = 50 switching times, e from 10% to 90% and from 90% to 10%, i f = 70 ma, r l = 50 t r , t f 15 ns durchlassspannung forward voltage i f = 70 ma, t p = 20 ms i f = 700 ma, t p = 100 s v f v f 3 ( < 3.5) 4 (< 5.2) v v sperrstrom reverse current i r not designed for reverse operation a gesamtstrahlungsfluss total radiant flux i f = 70 ma, t p = 20 ms e typ 80 mw temperaturkoeffizient von i e bzw. e , i f = 70 ma temperature coefficient of i e or e , i f = 70 ma tc i ? 0.5 %/k temperaturkoeffizient von v f , i f = 70 ma temperature coefficient of v f , i f = 70 ma tc v ? 2 mv/k temperaturkoeffizient von , i f = 70 ma temperature coefficient of , i f = 70 ma tc + 0.3 nm/k kennwerte ( t a = 25 c) characteristics (cont?d) bezeichnung parameter symbol symbol wert value einheit unit
2011-10-20 4 sfh 4258s, sfh 4259s strahlst?rke i e in achsrichtung 1) gemessen bei einem raumwinkel = 0.01 sr radiant intensity i e in axial direction at a solid angle of = 0.01 sr bezeichnung parameter symbol werte values einheit unit sfh 4258s -u sfh 4258s -v sfh 4258s -aw strahlst?rke radiant intensity i f = 70 ma, t p = 20 ms i e min i e max 40 80 63 125 100 200 mw/sr mw/sr strahlst?rke radiant intensity i f = 700 ma, t p = 25 s i e typ 480 750 1200 mw/sr sfh 4259s -t sfh 4259s -u sfh 4259s -v strahlst?rke radiant intensity i f = 70 ma, t p = 20 ms i e min i e max 25 50 40 80 63 125 mw/sr mw/sr strahlst?rke radiant intensity i f = 700 ma, t p = 25 s i e typ 300 480 750 mw/sr 1) nur eine gruppe in einer verpack ungseinheit (streuung kleiner 2:1) / only one bin in one packing unit (variation lower 2:1)
sfh 4258s, sfh 4259s 2011-10-20 5 abstrahlcharakteristik radiation characteristics i rel = f ( ? ) abstrahlcharakteristik radiation characteristics i rel = f ( ? ) 0 0.2 0.4 1.0 0.8 0.6 ? 1.0 0.8 0.6 0.4 0? 10? 20? 40? 30? ohl00021 50? 60? 70? 80? 90? 100? 0 20? 40? 60? 80? 100? 120? sfh 4258s sfh 4259s ohl00999 0? 20? 40? 60? 80? 100? 120? 0.4 0.6 0.8 1.0 100? 90? 80? 70? 60? 50? 0? 10? 20? 30? 40? 0 0.2 0.4 0.6 0.8 1.0 ?
sfh 4258s, sfh 4259s 2011-10-20 6 relative spectral emission i rel = f ( ) forward current i f = f ( v f ) single pulse, t p = 100 s 0 10 20 30 40 50 60 70 80 90 100 700 725 750 775 800 825 850 875 900 925 950 lambda i rel % nm 1 10 100 1000 2345 v f [v] i f [m a] radiant intensity single pulse, t p = 25 s permissible pulse handling capability i f = f ( ), t a = 25 , duty cycle d = parameter i e i e 70 ma = f ( i f ) 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+00 1.e+01 1.e+02 1.e+03 i f [ma] i e / i e(70ma) 10 10 0 -2 -3 -4 -5 10 10 10 f i a p t = d t 2 1 0 -1 10 t p 10 s 10 ohf04490 t t p i f 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.75 0.02 0.1 0.05 0.5 0.2 1 0.01 0.005 d = max. permissible forward current i f = f ( t a ), r thja = 300 k/w permissible pulse handling capability i f = f ( ), t a = 85 c, duty cycle d = parameter 0 10 20 30 40 50 60 70 80 0 20406080100 t a [c] i f [ma] 10 10 0 -2 -3 -4 -5 10 10 10 f i a p t = d t 2 1 0 -1 10 t p 10 s 10 ohf04491 t t p i f 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.75 0.02 0.1 0.05 0.5 0.2 1 0.01 0.005 d =
sfh 4258s, sfh 4259s 2011-10-20 7 ma?zeichnung package outlines ma?e in mm (inch) / dimensions in mm (inch). geh?use / package power topled ? mit linse, klarer verguss / power topled ? with lens, clear resin anschlussbelegung pin configuration 1 = kathode / cathode 2/3/4 = anode / anode 3.8 (0.150) max. ?2.55 (0.100) 0.13 (0.005) 0.18 (0.007) 0.1 (0.004) typ 1.1 (0.043) 0.5 (0.020) 2.6 (0.102) 3.4 (0.134) 3.0 (0.118) 2.1 (0.083) 2.3 (0.091) 3.0 (0.118) 3.7 (0.146) 3.3 (0.130) 4?1 gply6127 0.4 (0.016) 0.6 (0.024) 0.9 (0.035) 0.7 (0.028) 1.7 (0.067) 2.1 (0.083) 0.6 (0.024) 0.8 (0.031) 34 1 2 ?2.60 (0.102) package marking (2.4) (0.095) sfh 4258s 3.5 (0.138) max. ?2.55 (0.100) 0.13 (0.005) 0.18 (0.007) 0.1 (0.004) typ 1.1 (0.043) 0.5 (0.020) 2.6 (0.102) 3.4 (0.134) 3.0 (0.118) 2.1 (0.083) 2.3 (0.091) 3.0 (0.118) 3.7 (0.146) 3.3 (0.130) 4?1 gply6128 0.4 (0.016) 0.6 (0.024) 0.9 (0.035) 0.7 (0.028) 1.7 (0.067) 2.1 (0.083) 34 1 2 ?2.60 (0.102) package marking (2.4) (0.095) sfh 4259s
2011-10-20 8 sfh 4258s, sfh 4259s empfohlenes l?tpaddesign reflow l?ten recommended solder pad design reflow soldering empfohlenes l?tpaddesign wellenl?ten ttw recommended solder pad design ttw soldering ohfp3021 padgeometrie fr verbesserte w?rmeableitung improved heat dissipation paddesign for l?tstoplack solder resist 0.8 (0.031) 3.7 (0.146) 1.1 (0.043) 2.3 (0.091) 3.3 (0.130) 1.5 (0.059) 11.1 (0.437) cu fl?che / 16 mm per pad 2 cu-area _ < 3.3 (0.130) 0.7 (0.028) ohpy3040 6.1 (0.240) 2.8 (0.110) 2 (0.079) 3 (0.118) 6 (0.236) 2 (0.079) 1 (0.039) 2.8 (0.110) 0.5 (0.020) solder resist l?tstoplack pcb-direction bewegungsrichtung der platine 2 (0.079) padgeometrie fr improved heat dissipation verbesserte w?rmeableitung paddesign for 2 cu fl?che / > 16 mm per pad cu-area
sfh 4258s, sfh 4259s 2011-10-20 9 l?tbedingungen vorbehandlung nach jedec level 2 soldering conditions preconditioning acc. to jedec level 2 reflow l?tprofil fr bleifreies l?ten (nach j-std-020d.01) reflow soldering profile for lead free soldering (acc. to j-std-020d.01 ) profileigenschaften profile feature bleifreier aufbau / pb-free assembly (snagcu) empfehlung / recommendation grenzwerte / max. ratings aufheizrate zum vorw?rmen* ) / ramp-up rate to preheat* ) 25 c to 150 c 2 k / s 3 k / s zeit t s von t smin bis t smax / time t s from t smin to t smax 150 c to 200 c 100 s min. 60 s max. 120 s aufheizrate zur spitzentemperatur* ) / ramp-up rate to peak* ) 180 c to t p 2 k / s 3 k / s liquidustemperatur t l / liquidus temperature t l 217 c zeit t l ber t l / time t l above t l 80 s max. 100 s spitzentemperatur t p / peak temperature t p 245 c max. 250 c verweilzeit t p innerhalb des spezifizierten spitzentemperaturbereichs t p - 5 k / time t p within the specified peak temperature range t p - 5 k 20 s min. 10 s max. 30 s abkhlrate* ) / ramp-down rate* ) t p to 100 c 3 k / s 4 k / s maximum zeitspanne von 25 c bis zur spitzentemperatur / time from 25 c to peak temperature max. 8 min. alle temperaturen beziehen sich auf die bauteilmitte, jeweils auf der bauteiloberseite gemessen / all temperatures refer to the center of the package, measured on the top of the package * steigungsberechnung t/ t: t max. 5 s; erfllt ber den gesamten temperaturbereich / slope calculation t/ t: t max. 5 s; fulfillment for the whole t-range 0 0 s oha04525 50 100 150 200 250 3 00 50 100 150 200 250 3 00 t t ?c s t t p t t p 240 ?c 217 ?c 245 ?c 25 ?c l
2011-10-20 10 sfh 4258s, sfh 4259s wellenl?ten (ttw) (nach cecc 00802) ttw soldering (acc. to cecc 00802) published by osram opto semico nductors gmbh leibnizstra?e 4, d-93055 regensburg www.osram-os.com ? all rights reserved. the information describes the type of component and shall not be considered as assured characteristics. terms of delivery and rights to change design reserv ed. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. packing please use the recycling operators known to you. we can also help you ? get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of tr ansport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or system s must be expressly authorized for such purpose! critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support de vice or system, or to affect its safety or effectiveness of that device or system. 2 life support devices or systems are intended (a) to be impl anted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered. ohly0598 0 0 50 100 150 200 250 50 100 150 200 250 300 t t c s 235 c 10 s c ... 260 1. welle 1. wave 2. welle 2. wave 5 k/s 2 k/s ca 200 k/s cc ... 130 100 2 k/s zwangskhlung forced cooling normalkurve standard curve grenzkurven limit curves
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